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U.S. Government Export Block Could Prevent Apple Using Chinese 3D NAND

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Apple has seemingly cancelled its plans, which we reported (opens in new tab) in September, to source 3D NAND chips from Chinese manufacturer YMTC (Yangtze Memory Technologies Corp). The move, per an article on Nikkei Asia (opens in new tab), comes following political pressure from the U.S. government.

(Image credit: Apple)

The story, which cites ‘multiple sources’, claims Apple’s deal has fallen foul of U.S. export controls imposed on China, despite the lengthy certification process for the 128-layer storage chips having been completed. The chips, described as the most advanced yet produced by a Chinese foundry, still lag behind those from Samsung and Micron but are noticeably cheaper as they’re subsidized by the Chinese government.

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