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TSMC Kicks Off 3nm Production: A Long Node to Power Leading Chips

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TSMC on Thursday held a “Volume Production and Capacity Expansion Ceremony” at its Fab 18 in in the Southern Taiwan Science Park (STSP). Fab 18 is where production of chips using its N3 (3nm-class) process technology take place. The foundry says that yields of the 3nm chips it mass produces are good and that the family of its N3 technologies will serve its clients for many years to come.

N3 in HVM

TSMC reportedly initiated high volume manufacturing (HVM) on its N3 fabrication process in early September. By now the first batch of chips has been produced and tested, so the formal announcement about volume production is generally designed to show that the foundry’s 3nm-class process is good for mass production and chips made on it yield ‘good.’ For TSMC, N3 is a very important family of process technologies as it will be the foundry’s last general-purpose node based on FinFET transistors and a node that will serve its customers for at least 10 years. In fact, TSMC says that N3 and its successors will be used to build ‘products with a market value of $1.5 trillion within five years’ of HVM.   

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