Intel’s Glass Substrates,  A Whole New Way To Crack Cores

Intel’s Glass Substrates, A Whole New Way To Crack Cores

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Silicon And Glass Make A Good Match

Intel are looking to make major changes to their chip designs with a plan to move from organic to glass substrates.  It will be quite a while before your desktop will see chips built with the new process, servers and AI chips will be the first to benefit from the new design.  While Intel have provided proof of concept chips using glass, we will likely be into the 2030’s before finished products start shipping to customers.

The benefits Intel suggests glass substrates will offer are impressive, including improved power delivery and a higher interconnect density.  They also expect that glass substrates can be laid out in thinner layers than organic ones which will extend the life of current EUV lithography, and that the ability to work at higher temperatures than with organics will offer a number of advantages.  The properties of glass substrates should allow for larger packages as well as higher yields than current materials, not to mention adding optical interconnects significantly easiser.

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