This is Intel’s foray into a disaggregated architectural design, with the four tiles connected via Intel’s Foveros 3D packaging. There are a number of firsts here, including the Intel 4 process node at the foundation of the new Compute tile.
Via Intel:
Compute tile – Contains the latest-generation E-cores and P-cores, both of which introduce new microarchitecture enhancements. This tile is built on Intel’s next generation Intel 4 process node bringing major advancements in power-efficient performance.
SOC tile – Integrates a Neural Processing Unit (NPU), bringing power efficient AI capabilities to the PC that are compatible with standardized program interfaces such as OpenVINO, among others. Intel has also added new low power island E-cores on the SoC tile directly attached to the SoC fabric. These cores are ideal for an entire class of low-power workloads and allows for further optimized power-efficient performance. The SoC also integrates Wi-Fi and Bluetooth, including Wi-Fi 6E, as well as media, with support for 8K HDR and AV1 codecs and HDMI 2.1 and Display Port 2.1 standards.
GPU tile – Incorporates Intel Arc Graphics architecture into the client SoC to deliver discrete-level performance in an integrated form factor. The leap in graphics capabilities with increased power efficiency enables Meteor Lake to achieve up to 2x gen-on-gen performance.
IO tile – Contains Intel’s industry-leading connectivity with integrated Thunderbolt 4 and PCIe Gen 5.0.
One of the most talked about aspects of the new architecture (at least during the Q&A this editor attended) was the addition of low power island E-cores in the SoC tile – which are distinct from the E-cores in the Compute Tile. SoC E-core utilization will come down to software and scheduling, but the potential energy savings for mobile platforms is very interesting.